Study Of Manufacturing Technologies Of MCM-C/D

The thesis was relied on the institute’s process condition where the author worked on. Combined with the author’s actual research work,the thesis studied the production technology of hybrid Multi-Chip Module (MCM-C/D) with the LTCC (Low Temperature Co-fired Ceramics) substrate carrier.Based on the technology, one type of product was produced successfully.The thesis introduced the production technology of the LTCC substrate which was used in MCM-C/D,the technology of thin film multiplayer wiring, and the assemblage and package technology. In the thesis, we introduced some technology especially. For example, the production technology of LTCC substrate which contains cavity, thermal via, embedded component.; the process technology of dielectric film on LTCC substrate; the through hole forming technieiue; the metal wiring layer technology and the advanced assemblage and package technology of MCM C/D, and so on.One DSP main control logic modul e was accomplished efficiently, which supply beneficial conditions for the practical research.The MCM-C/D technology studied in my thesis has strong practicality.It can be used in military micro electronic products’high performance integrated effectively and reliably.