Research On The Indirect Liquid Cooling Technique Based On Microchannels

With the progress of nanofabrication technology, the computer chips aredeveloping towards to the high-density and miniaturization. However at the sametime it is accompanied by the increasing of power dissipation per unit area andcooling requirements when chips are running. Therefore, a new efficient coolingmethod is needed instead of traditional one which is hard to meet requirements ofsuch high-power chips. In this case, the microchannels cooling technology isprovided and studied as a hot research field. To deeply understand its regularity andcharacteristics, and apply it to the existing mature indirect liquid cooling system, Inthis thesis there are mainly three parts of research as following.First of all, the finite element simulation software is used to do the simulationstudies of microchannel cold plates, and as a result the cooling performance of coldplates with different sizes and structures is acquired. According to simulation resultsand different performance of microchannels machinability, it is determined to do thedeeply research of the rectangular microchannel cold plate.Secondly, in determining the microchannel structure, according to weldingprocess features, the symmetrical design method is proposed. The specific structureof microchannel cold plate is designed, and corresponding process of cold platemachining is developed.A reasonable way of the cold plate welding is determined.The cold plate welding quality is analyzed, the rationality and machining of coldplate structure with microchannels are evaluated.Finally, cold plate cooling performance test system is set up. The coolingperformance of conventional flow cold plate and the one with microchannels istested. By analysis of test results, it is concluded that cooling performance of coldplate with microchannels is better than conventional flow one, and it is getting betterwith the increasing of cooling fluid flow speed and decreasing of microchannel size.