Calderon Technique Based Integral Equation Methods In Computational Electromagnetics

Electronic Chemicals is the leading industry of China’s "Twelfth Five-YearPlan" to determine the information industry, the photovoltaic industry, newenergy industry and other strategic emerging industries. It has a great future inthe field of high-performance communications equipment, networking,automotive electronics, fifth-generation light source technology. It is just parts ofthe electronic chemicals that the polishing-fluid in the printed circuit board (PCB)and the conductive phenolic resin fixed with copper are in this study. A newtechnique of the polishing-fluid in PCB is gained through the analysis on stabilityand polishing results. It has the potential to be widely used. Besides, the reactionconditions and the nature have been gained of the phenolic resin fixed withcopper.There is the best ratio of the polishing-fluid in PCB though the research of different solventsystem and additives:3%of aluminum oxide polishing powder,0.1%of activated carbon powder,0.5%gallic acid, about96%of ethanol. By the study of three systems of polyethylene glycol400, ethyleneglycol and ethanol, the characters of the polishing-fluid such as viscosity and surface tension have beenacquired. The related discussion of the regular pattern has also been made between a variety of inorganicand organic additives and the three systems on the ability and polishing ability of the polishing-fluid inPCB. It is found that the activated carbon powder has a special function in the stability of thepolishing-fluid system in the study. So the activated carbon powder has a significant role for ethanolpolishing-fluid in promoting.The conductive phenolic resin fixed with copper has been made up in one step with copperpowder, formaldehyde, phenol and sodium hydroxide as raw material. The best radio ofthe conductive phenolic resin fixed with copper reaction is phenol: formaldehyde: sodiumhydroxide=1：（4~5）：3. The optimum reaction condition is: temperature70℃, andthe reaction time is4.5hours. Curing temperature is150℃and the curing time is2hours. When the quality of the copper powder takes up75%~80%of the total qualityof the cured composite, the volume fraction is about40%and the resistance rate is about100Ω/cm. When the phenol: formaldehyde solution>0.5, the products with higher levels of free phenol in the cured composite material has obvious smell of phenol. Whenthe pH <13, the reaction is not completed. After6hours’ reaction, the free phenol andfree formaldehyde are more residues.