Key Technology Research Of OLDE Devices Indium Sealing

OLED (Organic Light-Emitting Diode) display has some characteristics:all-solid-state display, very thin (less than one-third of the volume and weight of theLCD), high brightness and contrast, ultra-low power consumption, fast response rate(≤10μs), wide viewing angle, self-luminous, low cost and simple processing technic,high luminous efficiency, etc. All these advantages make OLED display known as theleader of the third-generation display technology. Research of OLED has gradually gotmatured. OLED devices have been studied in the laboratory and then appeared in themarket, whose industrialization is forming gradually. But at this stage, the OLEDdisplay devices are mainly applied in the relatively small size displays, mostly in mobilephones, in-car displays and MP3. At present, the OLED display devices present somedisadvantages, such as low yield, high cost and the device lifetime is generallyrelatively short, which have hindered the pace of further development andcommercialization of OLED display. Now studying how to improve the life of OLEDdevices to increase their competitiveness in the market is of great significance. Byoptimizing the packaging method to improve the lifetime of the OLED device iscurrently the most direct and effective method to improve the service life of an OLEDdevice.At first, this article describes the development of OLED devices from experimentalstudy toward market and summarizes the disadvantages and advantages of OLEDdevices at present. Then it describes the principle of luminous OLED devices, as well asthe main structure of the OLED device. Also it analyzes and summarizes the mainOLED devices encapsulation method and the main reason for the failure of OLEDdevices.Next, this article describes the advantages and main issues of FOLED (FlexibleOrganic Light-Emitting Diode) device and it details the main currently used substrate inFOLED devices. It starts with the performance of mica flakes and puts forwards aprogram in which using mica flakes as FOLED devices substrate, then designs thestructure and packaging principle of mica substrate FOLED devices. At last, this article studies the influencing factors of the life of the UV plasticencapsulated OLED devices and OLED devices in the high vacuum environment,reaching the conclusion that water vapor and oxygen is only one reason influencing thelifetime of the OLED device and there are some other important causes leading to thedecreasing of the lifetime of OLED devices. Then it describes an experiment usingindium sealing in OLED devices and the hydrochloric etching of ITO substrate methodoptimizes the traditional low-cost tape etching of ITO. The experiment learns thin filmmethod and the desired process parameters of cover package borders of the layersprepared by indium sealing. Respectively, this experiment optimizes the design of theheating layer and the metal buffer layer of the mask and the coating process research ofSiO2insulation layer. At last, the indium sealed border with each high-performancefunctional layer is prepared through a large number of experiments. In the nextparagraphs, it introduces the method of preparing indium-tin alloy and indium-bismuthalloy on the metal buffer layer and the sealing layer of the indium-tin alloy andindium-bismuth alloy is obtained. Finally, it studies indium sealing processrequirements of substrate and covers board and get a good sealing performance indiumsealing device.Due to the limitations of research time as well as the experimental hardwarefacilities, the functional layer film by indium sealing is got and the upper and lowersubstrate package is came true through the optimization of process parameters anddesign project. The experimental program and method of the preparation of indiumsealing as well as the experience and processing requirements and parameters of thesuccessful sealing in this article are a solid foundation for indium sealing applying inOLED devices and FOLED devices in the future.