The Properties Researching Of Indium Solder For Semiconductor Lasers Package

Semiconductor lasers play an irreplaceable role, because of its excellent performance, on the market of laser devices. They have been widely used in military, medical, material forming and processing and so on. With the development of technology, the application of semiconductor laser will be more widely, and there will be a higher requirement on the performance of semiconductor lasers. So there must be a higher requirement on the production and packaging process of semiconductor lasers.This paper presents the manufacturing and packaging process of the semiconductor laser briefly. The packaging process has a direct influence on the performance of semiconductor laser, and it is an important factor that the choice of solder which determines the quality of packaging. Ag protect layer can be formed on the surface of indium solder has been proved through many experiments. But most of Ag-In compounds are brittle phases. The excessive brittle phases between the solder and chip will generate a great deal of stress. This paper based on the knowledge of the properties of solder metal, metal diffusion theory and the theory of phase transition, studied the performance of Ag-In solder from different aspects as follows.(1)Solder on Si substrate was prepared and covered with different thickness of Ag layers on solder. The microstructure and composition of solder was analysed by SEM and XRD. Then the solder was keeping at a high temperature. After that, the changing of microstructure and composition of solder between before and after the high temperature treatment was observed.(2)The composite solder with different Ag layer were heated to melting temperature and cooled to room temperature at different speed. The protect effect of different thickness Ag layers were researched under this condition. Then the affection of different cooling speed was discussed.(3)At last, A multi-layer solder structure was designed by theory analysis, and its superiority was descripted briefly. What’s more, the analysis of microstructure and composition of new structure solder was presented by SRM and XRD. In addition, electricity resistance of the solder also has been measured.