Study On Surface Metallization Of Resin-based Composites And Film-substrate Interface

Resin-based composites was the first choice of aerospace structures material in the world due to its low weight, high Specific strength, high Specific modulus, Small thermal expansion coefficient and outstanding designability characteristic, and was applied widely in aerospace. When composite materials instead of metal was used in the spacecraft, space craft weight can be reduced and launching cost saved, with original mechanical property maintained or improved. However, resin-based composite materials is facing the problems of space protection requirement and inadequate electrical properties on its surface, because of the special space application environment and the new develop requirement of space technology. As a result,shortcomings of resin-based composite materials sets back the development direction of space craft with high power, long life and high reliability as well as further application of composite itself seriously.In order to solve the problem for engineering application, surface metallization of resin-based composite materials with arc ion deposition technique were studied. In this paper, we study and sum up the influence of key technical parameters on electroconductivity and adhesion of the film. Finally, film-substrate interface were researched by different testing methods such as XPS, XRD, SEM, EDS. The main investigations of this paper were shown as follows:1. Several kinds of metal films on the surface of the resin-based composite materials were studied on electroconductivity and space protection for application in the space, it was found that Ti is the best for space protection, but has the worst electroconductivity, Cu has the best electroconductivity, but the worst for space protection, Al is excellent for both space protection and electroconductivity.2. Aluminum films were deposited on the surface of resin-based composite materials with arc ion deposition technique, influence of deposition temperature and arc current on electroconductivity and adhesion of the film were studied and summed up.3. Based on XPS analysis, Al-O, Al-N and Al-C bond were found in film-substrate interface.4. film adhesion can be improved effectively by using ion beam bombardment before deposition in virtue of surface texturing which add areas between base and film, and breaking chemical bonds in the resin and helping to forming new chemical bonds in the film-substrate interface.