Research On The Application Of Visual Inspection Technology In High Precision Wafer Scribing System

The application of Visual Inspection Technology in high precision Wafer Scribing System is researched and developed in dissertation. In wafer scribing process, as the wafer chip becomes smaller, the scribing precision demands higher, new scribing technology need to be developed. And in order to improve the machining efficiency and automation degree, a method based on visual inspection is proposed to realize automatic wafer scribing process on the basis of researching the features of wafer image.First of all, the hardware platform is designed according to the characteristics and the process requirements of wafer. A wafer special scribing equipment is assembled which includes the Microscopic Camera, the Machine Platform, and the Motion Controller System and so on. And the communication between them is realized through the Industrial Computer System. Then the Software Control Program is developed with the help the VC++Platform. It will be able to realize to capture the Wafer Microscopic Amplification Image and process the image and finally get the wafer position information, so as to control the movement platform for rapid precision scribing.After studying the amplification image characteristics of the wafer, a feature detection method based on the wafer image is proposed in this text. The detection method can realize wafer angle position automatic correction and wafer clearance of accurate positioning. The image processing process is also studied in the paper; through improving algorithm and technical parameters, the image pixel level detection precision positioning is completed, and the positioning accuracy of the wafer is further improved.The system which is developed combines the visual detection with the motion control effectively, realizes the machine visual control motion position; and finally has completed the high accuracy wafer scribing. Through the debugging test and processing measurement verification, the system and the detection method can effectively improve the wafer processing efficiency and the chip yield.