Ulsi Lithography Graphics Line Width Modulation Optimization Research

In the semiconductor manufacturing process, lithography technology is one of the most critical technologies of integrated circuits, which is an important economical impact factors throughout the product manufacturing. The cost of lithography occupies30to35percentage of that of overall the manufacturing loop. Lithography technology is also the important reason why integrated circuits developed following the Moore raw. While the line width of the lithography process is becoming smaller and smaller, the line width and uniformity of lithography has more and more impact on industrial manufacturing. And this problem has not been solved.Any step in coating-developing loop is one of the important factors in decision of the line width control. For the ideal line width, we need do more controlling for any procsess steps in the coating and developing.By many series of researches, many kinds of factors which impact the line width are gained and classified. In these factors,2factors that is soft-baking time and PEB time are the highest, and the volume of photo resist dummy is the lower. Then, point to the important factor, it is successful to improve the baking process time for DUV tools in IMES system and to reduce the unnecessary control parameter in the IMES system; by reducing the photo resist dummy volume, the manufacturing cost is trend down much.