Application Issue Analysis Of Die Attach Paste

With the improvement of electronic packaging technology and thewide application of die attach paste, the application process optimizationand related failure analysis of die attach paste have been paid more andmore attention. In this thesis, three kinds of application issue includingdie warpage optimization, dispensability optimization and delaminationfailure analysis are mainly analyzed, and define the related analysisme t h od. D ur in g t he d ie w a r pa ge o p ti mi z a t io n a na l ys is, c u rin gtemperature and time have been studied, and also considering the dieshear stress requirement from customer, find out the two steps cureprofile is the best choice. It is possible to optimize the warpageperformance without changing material. During the dispensabilit yanalysis, study the influence of needle inner diameter, valve on time,dispensing pressure, dispensing gap and dwell time, and define themethod of dispensability study. It is useful to set up equipment andimprove the dispensing efficiency during mass production. From theexample of delamination failure analysis, it indicates that the principle offailure analysis is to start from non-destructive analysis, and followed bydestructive analysis. It is important to analyze the failure step by step,consider the information get gradually, and continuously adjust andoptimize the analysis plan to make sure find out the real root cause.