The Design Of The Pressure Sensor And Packaging Technology Research

As the result of the rapid development of modern science and technology, application of sensors become very extensive. Pressure sensor is representative in various types of sensor. It provides a great help for our daily life.Piezoresistive pressure sensors are made by silicon. It is combined with MEMS technology and integrated circuit manufacturing processes to make flexible film and varistors. External compensation and output circuit are designed in a pressure sensor. Piezoresistive pressure sensor has a miniature, integrated, multi-functional and intelligent features. Pressure sensors in water conservancy and hydropower, railway transportation, intelligent buildings, production automation, aerospace, military, petrochemical, oil wells, power, shipbuilding, machine tools, pipeline, medical and other fields have a very broad application space.In this thesis, sensor theory and principle are studied. The key parameters of the sensor chip and its package are researched. The thesis includes research of pressure sensor device design and packaging experiments, which is still in its infancy in China. The main content of this paper including:1) Piezoresistive effect and the piezoresistive coefficient of silicon material are introduced, and its temperature compensation and sensitivity are studied.2) The related theory of silicon-glass electrostatic bonding is introduced, the sensor chip package on its properties is analyzed.3) The parameters of the size of the piezoresistive pressure sensor are analyzed and calculated, sensor elastic film stress simulation is researched by ANSYS, the placement and shape of the resistance is designed. Chip performance is calculated. Sensitivity of temperature drift compensation is analyzed.4) Boron phosphorous silicon glass, which is the best bonding materials, is used in experiment.5) Bonding instrument was designed and produced, the optimum parameters of temperature and voltage were found out.