The Research Of Noc’s Thermal Analysis Based HotSpot

With the reduction in the size of the process characteristics of CMOS devices, hot issues in deep submicron integrated circuit design.One of the most challenging problems. Meanwhile, the interconnect delay estimation in deep submicron integrated circuit design has been prepared concern. On one hand, with the decrease of the signal rise time and interconnect length increases, the interconnect inductance effects more And more important, and the temperature will affect the delay, delay model must include the interconnection inductance and interconnect thermal effect; the other hand, with decreasing feature size, integration density and power consumption increase leads to a higher chip temperature and chip temperature gradient, thereby affecting the delay, power consumption and reliability.As a result, the position of the thermal analysis is more and more important, the HotSpot is a new thermal simulation software, it has a high precision simulation level, the simulation speed is fast. Chip interconnection, structure and layout of the study, has a very wide range of applications.The interpolation algorithm is the use of known data to obtain a class of program unknown grid point data, which, considering the grid values of accuracy and speed from the Inverse Distance to a Power, Modified Quadratic Shepard Method, Kerging’s, etc. are optional programs. Cressman interpolation in the field of atmospheric science use, the article compares the pros and cons of these types, put forward my own views on the interpolation.Depth analysis of the hotspot temperature analysis algorithms using the new interpolation scheme for data processing, draw a new code to handle the details of temperature provides a guideline for the hotspot. And3DNoC processing provide insights...