After 0.18 Mu M Integrated Circuit Process Metal Defect Detection Research

So far 0.18um technology is very stable. So defect is major factor to affect yield. For 0.18um technology production, there are more backend metal layers. Usually there are 5 layers or 6 layers. So the productions have more sensitivity about metal layer defect. The key point of 0.18um production yield enhancement is to do backend metal layer defect reduction. This thesis systematic studies the defect classify in the company inline. Base on analysis and experiment, we discuss the defect characteristic and root cause. After comparing the different defect scan tool characteristic with analysis in depth, we bring up the best way for 0.18um production backend metal layer defect method.After introduce the background and system resource, we study the defect classification and defect characteristic. After collect enough scan sample, we find out major metal layer defect is metal residue, corrosion, surface particle and buried particle. Base on analysis and experiment, we found these 4 types defect have different root cause and characteristic. Metal residue and corrosion have the correlation with metal etch. These 2-type defects are all during metal line. And defect background image are complex. Surface particle and buried particle have correlation with metal film deposition. Defects are all buried in the film or on the film surface. Defect background image is simple. And then we study the optimum scan method base on defect scan tool configuration. Because bright field defect scan tool use uprightness lamp and collect reflect light signal to create image, we suppose that bright field tool has more sensitivity about the defect after metal etch. Base on analysis, because scatter signal of defect which is during metal line will be blocked by metal line, it is supposed that dark field tool will have less sensitivity about the defect after metal etched. But because scatter signal of particle that is on the flat film is very strong, it is supposed that dark field tool will have more sensitivity about the defect after metal film deposition. In addition, we provide a special dark field tool scan metal bridge defect method base on the dark field tool special configuration. Because this special dark field tool has acclivitous lamp and sensor, it is supposed that if the lamp and sensor direct match metal line direct, the dark field tool will have more sensitivity improved about metal bridge defect. We verify the all proposal ok with experiment. At last, we use 2-inline applications to verify the proposal practicality. The thesis gives out the best solution for the metal layer defect inspection. And the method is all used to inline defect inspection. After all the actions have been implemented, accuracy and efficiency for 0.18um metal layer defect inspection have been enhanced. And it stops the worse defect issue in time. This induces company cost down and ship higher yield lots to customer.