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Contour Plate Bending Forming Technology Research To Crinkle

Posted on:2013-02-12Degree:MasterType:Thesis
Country:ChinaCandidate:Y Z DengFull Text:PDF
GTID:2241330371494476Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
The profiled plate is widely applied to the modern steel structure buildings for its light weight and high strength, beauty and durability, heat insulation with the correspondent material, and good sound insulation. A new project and task was put forward for the processing of profiled plate because of the widespread appearance of circular arc and bend shapes on the roof and wall of modern architecture. Crimp curve is a common technique for the bending of profiled plate. The research status at home and abroad, however, is to adopt the method of trial production experiment to modify mould and to determine the process parameters of bending, which lacks theoretical foundation and reference.The thesis mainly makes use of the finite element analysis (FEA) software ABAQUS to simulate the whole crimp curve process of profiled plate, analyzes the principle and the forming mechanism of crimp curve process, conducts the model modification of crimp curve based on the stress-strain analysis of typical points of profiled plate in the forming process of crimp curve, conducts the orthogonal experimental design and simulation of process parameters, and studies the optimization of orthogonal parameters and the prediction model of bending curvature radius.Studies shows that the principle of crimp curve process of profiled plate is that the bend is caused by the flow of materials required by profiled plate when pressing compacting groove and protrusion, and the crimp curve of profiled plate is based on the superposition of multi-pass stamping. According to the specific stress-strain appearance of profiled plate in the forming process, the model modification of crimp curve is conducted to adjust the round corner, clearance of model and the friction coefficient is reduced, to ensure the full compacting of profiled plate, to avoid such quality defects as fold,wrap, a large deformation, so as to improve the compacting quality of the bending of profiled plate.Influences of the parameters on bending curvature radius, thinning rate, stress, and equivalent plastic strain are analyzed, through conducting the orthogonal design and simulation of such process parameters as pressing spacing l, die clearance h, and pressing speed v. The results show that the significance sequence of process parameters which can influence bending curvature radius is l>v>h, the significance sequence of process parameters which can influence thinning rate is h>1>v, the significance sequence of process parameters which can influence stress is h>1>v, the significance sequence of process parameters which can influence equivalent plastic strain is1>h>v.The linear prediction model of the bending curvature radius,exponential relationship prediction model and quadratic nonlinear prediction model are built respectively. Compared with the simulation results, the prediction model built by the quadratic nonlinear equation is better than the others. And the significant test of equation is conducted, showing that the prediction model is significant which can prove the credibility of prediction model on the basis of simulation results.This thesis conducts the numerical simulation of crimp curve process of profiled plate, analyzes the technical principle, studies and optimizes the process parameters of crimp curve process, and builds the prediction model of bending curvature radius, all of which provide theoretical foundation and reference for the further research of crimp curve process, the design and modification of model, and the actual production.
Keywords/Search Tags:profiled plate, crimp curve process, model modification, process parameter
PDF Full Text Request
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