Leveling Technology Research Based On Flexible Squeeze Head

In the field of micro/precision machinery manufacturing, in order to ensure the precision accuracy of the size of parts or assembly, the micro-displacement mechanism is used to realize parallelism in many working conditions. The leveling technology plays an increasing role in the research of micro/Nano-scale structures and devices, with the development of MEMS, bio-chip technology and so on, especially in recent years. So a passive leveling squeeze head is designed in this paper, based on the deformation characteristics of flexible hinge. In addition, the application equipment of the leveling squeeze head is developed, and the relevant leveling technology is researched deeply.On the basis of analyzing the leveling mechanism on flexible squeeze head, the optimization analyses of structural shape and dimension are finished. The Leveling ability and dynamic performance of the squeeze head are discussed through the method of finite element simulation software ANSYS and the45steel is selected as the component materials. The stress, rotational stiffness and natural frequency characteristics of the squeeze head are discussed through the mechanics of materials knowledge and ANSYS. The round structure is selected as the shape of flexible part, and the dimensions of sensitive parameters "a" and "b" are confirmed. From above research, the squeeze head obtains optimum mechanical properties. The design is completely finished.According to the structural characteristic of the squeeze head, the relative leveling technology is deeply researched by theoretical knowledge and experiment analyzed. In order to evaluate the pressure contribution consistency of the contact surface, the concept of the relative pressure difference percentage is put forward. The quantitative analysis of the pressure distribution is achieved. The research results show that, the squeeze head keeps stiffness consistency in the leveling process, and the deformation compensation reaches easily in allowable load. When the load on the squeeze head is about1000N, the leveling characteristic in single or any directions obtains a fine level. In the experiment, based on collecting several pressures by FUJI PRESCALE, the experiment results are carried out through image processing, and the conversion from color density to pressure is realized.In order to test and verify the practicability in engineering of the squeeze head, the corollary application equipment is built, and the equipment can control the movement and pressure accurately. When using of the flexible squeeze head in the polymer microstructure manufacture and indium seal process, the expected destination will be reached.