Research On Fluid Flow And Heat Transfer Characteristics Of Liquid-cooling System

The power density of the electronic device is sharply increased, so that the cooling demand of equipment is more and more urgently. Therefore, seeking for the new cooling technology in imminent. The typical technologies utilize air to carry the heat away from a heat sink. The simple or forced air-cooling can meet the requirements when heat flow density of the electronic is not big. Otherwise, when the number of chip is more, the position and dispersion of space size request strictly which require more aggressive cooling technology. A high-performance alternative to air cooling system is a liquid-air hybrid cooling system. Liquid cooling not only can dissipate the heat of distance-distributed electronic but also has the dexterous structure and noising mildly. So simply a passing fad since its advantages have become more compelling with each generation of electronic equipment, and now it is an increasing concern struggling to provide the needed level of thermal performance for many applications. In this paper, the cooling fluid cold plate system network model is built based on the combination of the software of Fluent and MacroFlow. Meanwhile,the experiment results show that flow and heat transfer performance of this fluid cold plate and pipe network system. The specific contents are described as follows:The presented thesis describes the theory of liquid cooling system, firstly, we reviews the current research status of liquid cooling technology and the using status of the liquid cooling system. Next, one new type liquid cooling system with allusion to the dissipated and multi-heat module is presented which comprised cold plates. The idea is to measure the heat transfer performance of the devices for liquid cooling precisely.A rectangular channel cold plate is designed to adapt the cooling requirements in this paper. The software Fluent is used for simulating the resistance and the heat transfer characteristic of the cold plate. Moreover, Flow simulations of the system with macroflow which is also processed. This software is professional system level for thermal design; it can obtain the better improvement optimization result. The increasing the resistance method is used to optimize the system, in order to distribute the flow of the network reasonably.A small fluid-cold cooling system with multiple parallel is also built. The simulation result of the cold plate and pipe-network system using the software was tested consistency. Identically, the law of flow and heat transfer of the system and cold plate which optimized function was acquired through the test data. A resistance coefficient K is calculated which is corresponding with the branch to the open size of the valve. Finally, the paper presents a convenient and accurate method to design a reasonable distribution of the cooling system flow rate in the practical application.