Study On The Performance And Application Of Diamond Wire Saw By UV Cured Bond

New technical challenges have been posed to the traditional machining tools that applied to semiconductor hard brittle materials with the development of the modern semiconductor material towards the biger specification,higher accuracy,higher efficiency and the lower cost.In this prepartion of paper,prepapation and performance of diamond wire saw by UV cured bond was studied systemically.Firstly,we synthesized polyurethane acrylate(PUA),which can be used in UV cured bond.The rheological behavior of resins with different reachion conditions were investigated,and structure of the resins were charaterized with fourier transform infrared spectrograph(FT-IR).The several factors which influence the reaction and properties were studied,and the performance of diamond wire saw cutting was investigated。The results showed that:The polyurethane acrylate(PUA) was synthesized form touene-2,4-diisocyanate(TDI),polyester diols(POL-256) and hydroxyl propyl acrylate.The optimum reaction conditions of synthesis:the mol ratio of reactants was POL-256:TDI:HPA=0.5:1:1,the catalyst(DBTDL) and inhibitor(hydroquinone) in total mass was 0.1%respectively.The first reaction was POL-256 and TID,the reaction temperature was 40℃,then with the HPA,the temperature was 70℃.The effect of temperature on viscosity can be described by an Arrhenius type equation. When the reaction temperature was 70℃,POL-256:TDI:HPA=0.5:1:1, the catalyst and inhibitor in total mass was 0.1%respectively,the resin had the higest flow activation energy.Performance differs of PUA while using different Polyester Polyol (POL-256,polyether ether 220 and 330).By comparing the bond,we found that the PUA-330 bond had the highest shear bond strength,fastest curing speed a,highest gel content and relatively higher hardness.In the bond system:we found that PUA played an important role to improve the performance.The best mass ratio of bond was PUA-330:EA:GMA=8:6:12,the CN146 and photoinitiators was 4%and 5%in total mass respectively,the maximum shear bond shrength was 18.3MPa,after postprocessing the shear bond strength rose up to 19MPa. The bond can increase the glass-transition temperature,when CN146 was added and a post-processing.In addition,the hybrid system of EA/ bisphenol A epoxy resin(E-44) may exist IPN network structure by transmission electron microscopy(TEM) and dynamic mechanical thermal analysis(DMA). Self-made UV cured bond for making diamond wire saw by UV cured with excellent performance,it could consolidate diamond in the steel wire surface,the diamond was a random distribution in the steel wire surface.The wire saw had a certain effect on cutting glass rod。...