The Wire Bonding Of Chip Nickel Palladium Bond Pads

This thesis was mainly to address gold wire bonded with different materials of wafer bond pad during assembly process. Based on advantages and disadvantages of gold wire bonded with aluminum pad which we often see, the thesis was to compare and contrast Nickel-Palladium Pad bonded with gold wire. Besides, we analyzed the workability and reliability of Ni-Pd pad bonded with gold wire.In the study, the correlation between four kinds of wire bonder parameter, were used as a control group and the best parameter of Ni-Pd Pad bonded with gold wire came out.According to Taguchi Quality Engineering, we found the proof that "Bond Temperature" is not the main factor to affect wire pull and ball shear. Therefore, the best parameter came out from the experiment.By way of the above parameters, we can get the most stable workability of Ni-Pd pad and gold wire. After1000cycles of temperature cycling test, there weren’t any inter-metallic crack occurred between surface of the Ni-Pd pad and gold wire.