The Nano-cutting Mechanism Research Of Polysilicon Based On Molecular Dynamics

In the process of NanoManufacturing of the polysilicon, the material removal quantitywith nanometer magnitude or even atomic magnitude, and the presence of multiple defectswithin the crystal grains. Therefore, the material removal process is essentially a discreteprocess. The polysilicon processing mechanism between Nano maching process and macromachining process are significantly different, the macroscopic cutting theory based on thecontinuous mechanics is no longer completely suitable for nanometer processing. Therefore,the exploration and research of nanometer processing theory of the polysilicon to improve thenanometric machining mechanism is going to be the important topic.Firstly, this paper established the theory model of the nanometer scale polysicon materialnanometer cutting process based on the mechanics theory, and proposed the MD methodwhich is used to the research of polysilicon nanoscale process, developed the simulationprogram based on the above.Secondly, established the nanometer polysilicon material model based on MD method, avariety of typical defects distributed reasonably in polysilicon model. For the relaxationprocess about the established simulation model, and got the system potential energy changecurve in the relaxation process and the atomic location plan after the relaxation.Thirdly, start the MDS about nanometer cutting process relying on the development ofthe simulation program, got the instant atomic position image, and draw cutting force curve.Discussed the influence of the typical defects on the polysilicon nanometer cutting process,mainly including the influence of cutting force, potential energy, temperature, deformationlayer thickness and processed surface quality, etc.Finally, start the simulation calculation respectively through the cutting parametersappropriate change which mainly about cutting speed, cutting thickness, tool rake angle, etc,get the comparative study with the simulation results, analysis and explore the influence lawof the different kinds of important cutting parameters within the cutting process, mainly including the influence on workpiece materials morphology structure, cutting force, systempotential energy, the workpiece temperature and processed surface quality in the cuttingprocess., on the basis of the above, the nanometer cutting mechanism of polysilicon arediscussed and summarized.