Modified Silicon Resin High Temperature Resistant Coating’s Development

Precision automation and man-made exhaust equipments, chimney, stove,heater, incinerators have a wide application makes heat coatings is of greatsignificance. Organic silicone resin has good heat resistance, resistance to wait,water resistant and superior performance, but its own defects restricted the morewidely used. Boron modified silicon resin of silicon boron key has excellentheat resistance, and epoxy resin modified silicon boron resin, can make theadhesion, and other comprehensive performance improved.Boric acid modified silicon resin preparation optimized conditions:polymerization temperature of85℃, reaction time is4h, R/Si for1.3, Ph/R for0.2, water consumption for silicon resin complete hydrolysis of the amount ofwater by50%, boric acid amount for silicon resin quality of11%. At this timethe b oxygen radicals resin content is1.06%, the500℃heat under3h massloss is14.68%, TG-DTA analysis shows that boric acid modified silicon resin in500℃, weightlessness8%,700℃weightlessness is only16.98%. Epoxy resinmodified silicon boron preparation the best conditions: epoxy resin and organicsilicon resin boron quality than for when0, l-butanol and cyclohexanone anddimethyl benzene mixed solvent for, the volume than for3:1:5, reactiontemperature150℃, reaction time for7h, make varnish film with GB/T1720performance-89, the GB/T1732-1993, GB/T1773-1993standard requirement.Epoxy modified silicon resin high temperature resistant coating of boronoptimum formula: nano SiO2dosage for epoxy modified silicon resin of25%,rutile type for nano TiO2than of5:1dosage of SiO2, black mica, the talcumpowder as2%of the resin content, polyamide curing agent dosage is0.5%,;Optimization process conditions: to the silane coupling agent KH-560processing specimens, besmear brushs the film thickness in140um, grindingtime120min.IR analysis and study of epoxy resin modified silicon boron resin structure,and the results show that the molecular chain has successfully embedded Si-O-B key, in polymer molecules and parts of hydroxyl surplus; TG-DTA studiedmodified epoxy resin and high temperature resistant silicon boron coatingthermal stability, and the results show that base resin and coating has a goodthermal stability, paint weightlessness500℃weightlessness rate when is32.56%, and that of700℃in weightlessness rate is47.75%; SEM and XRDanalysis shows that the use of pigments and fillers for good dispersancynanometer material; Coating adhesion, anticorrosion chemical resistance, andother comprehensive performance meet the GB/T1720standard requirements.