| In order to investigate the feasibility of polishing melting area of laser processing byabrasive flow machining, a rotating abrasive flow machining device was constructed andthree kind of media was confected for experiments with copper samples which wasprocessed by laser. The copper which is driven by axis rotate rapidly in medium cup whichfull of medium. Abrasive wear copper surface so as to achieve polishing goal. Closures playthe role of the constant volume, some weight can be added on it to achieve loading.The types of abrasives, pressure, polishing time, the laser processing parameters wasselected in turn for the variable and the change of material removal volume, surfacemorphology and melting area share was measured to analysis the effect of them onpolishing. The results showed that: melting area of laser processing will be effectivelyremoved by abrasive flow machining. Material removal volume will increase nonlinearlywith the increase of machining time and medium species, and will increase almost linearlywith the increase of pressure. The magnitude of the change of surface roughness is low ininitial stage and significantly increased in the following time.Based on the experiments, explicit finite element method is used to analyze theabrasive flow processing.Simulating the interaction of abrasive and copper surface underdifferent conditions of speed, pressure and the types of abrasives respectively. Summarizedthe variation of stress and energy in this model. |