Research On The Lapping Of Silicon Carbide End Rings

Silicon carbide is a kind of ceramics with optimum combination of properties,such as high elastic modulus, proper density, low coefficient of thermal expansion,resistance to high temperature, and resistance to corrosion, etc. And extensivelyapplied in ceramic ball bearings, semiconductor material, ball plug, gyro andmeasuring devices etc. However, because of its inherent brittleness, machining siliconcarbide is quite difficult and the manufacturing cost is very high. Grinding andpolishing is a good way to improve the quality of silicon carbide surface and raisestrainaway rate of the material. The key of higher process is using the better processingtechnic. So this study is focused on silicon carbide head face of ring. Discussinggrinding track, grinding mechanism and the process of gringding and polishing. Themajor research efforts include the following points.1. The article describe the basic process of grinding. Then describe the removemodel of silicon carbide. It refers to removal form of crisp and hard material about it’scontent. It set up two body and three body wear model and analysis material removalmodel’s change factor. Then it sets the relation between removal model of the materialwith concentration and pressure.2. Grinding workpiece with single side polishing. Then emulate the grinding trackand analysis the rate of rotating speed between Lapping Plate and workpiece,eccentricity and the distance between random point and center of workpiece’s effect togrinding track. Explain workpiece’s grinding uniformity in the end.3. Gringding contains coarse grinding and accurate grinding. Use the optimizedparameters (proper pressure, grinding speed and grinding liquid concentration).Processing efficiency is higher than normal processing technology and the workpiece’ssurface is good.And Grinding workpiece in these optimized parameters.4. In order to get high quality surface of workpiece. Do the single factorexperiment in the main effect factors such as polishing pad, press polishing, polishingdisk speed, abrasive grain and polishing concentration. Use the parameters from theexperiment on the polishing processing. Achieve the objecet of study in the fanal.