Experimental Study Of Thermal Contact Resistance Between Oxygen-free Copper And Metal Or And Nonmetal At Low Temperature

Since thermal contact resistance had been discovered, it has been the key point anddifficult topic in research and academic field. Low temperature solid-solid contactresistance characteristics is an important factor that can ensure reliable operation ofhigh-precision instruments, so many researchers study the object. Copper as a goodconductor materials is widely used in various electronic devices, this paper study thecontact resistance characteristics between copper and metal or non-metallic materialsusing of modulated photo-thermal method, and study its properties from the micro-levelthe mechanism.The experimental program was improved based on former conditions, and propagateof experimental samples met the test requirements. Samples were measured in the70K-200K temperature region of the contact resistance characteristics.A comprehensive study of methods of measuring the contact resistance conducted,and the selected the non-steady-state thermal modulation method. According to theexperimental, a complete experimental system was designed. The experiment detected thethermal diffusivity of samples, to pave the way for the follow-up experiments, andcontrasted to existing literature reference values to verify the methods. Different groups ofsamples were analyzed from the micro-level to explant the contact resistance betweencopper and metal or ceramic with different temperature and pressure. It was found that thecontact resistance between copper and metal is less than the contact resistance betweencopper and ceramic, in which copper-copper contact resistance is minimum. The thermalcontact resistance between copper and stainless steel or aluminum nitride decreases whentemperature increases, and increases when the pressure decreases.