The Common Failure Mechanism And Preventive Measures Investigation In The Electronic Product Assembly Process

The core of electronics is its PCBA (Printed Cirruit Board Assembly), PCBA fail is a critical issue. In order to find the root cause of its failure and solution, many common failure phenomenons was analyzed carefully, also with theory calculation and experiment. Meanwhile, the electronics general failure mode and mechanism in package processing was summarized, which contribute to analyze product failure in the following process. Importantly, the potential risk of product fail can be eliminated and the reliability is improved.It's found that electrostatic is critical factor which cause device fail in the processing through analyzing the mechanism of electrostatic damage (ESD) and its cause. ESD production is proposed in the packaging process based on the mode of discharge way and its caused failure result. Furthermore, the root cause of device fail in the packaging is disclosed if the device is moist. By calculating water content in the plastic sealed device and the related theory, it is approved that the moisture gasification creates dynamic charge, which induced device fail finally.Besides, the weld point failure mode is analyzed, the weld point reliability has strong correlation with process condition and material. Incorrect process parameter is the root cause of weld point failure.