The CAE Research On Packaging Properties Of Electronic Products

Involving electronic product packages as main research objects, this invertigation makes use of finite element method (FEM) to study their packaging properties and introduces the advantages of CAE (Computer-Aided Engineering) to the testing field of packaging priperties. It largely improves the efficency and accuracy of testing packing properties, reduces the testing cost, and shortens the testing cycle as well.The application of FEM in engineering field has largely been very vast and mature, however it is just in exploring phase in testing oacking properties, although started a long time ago. Many methods and others are also not very perfect. This paper sums up a lot of means in using Ansys to research packing properties master studies. The basic ways of investigation packaging properties with FEM are also concluded.As for compression tests, this research takes an example of LED package to simulate its compression in three different dimession on the basic of related testing standard. It carefully introduces the overall simulation process such as establishing models preprocess and postprocess and respective problems which should be take attentions. It analyzes the deformation, strain and stress of the LED's components while being pressed, finds out the potential structural problem of this package. Horizontial shocking and drop tests are different from static compression tests. Both of them belong to dynamic tests and involve the related knowledge of packaging dynamics. This paper discusses the respective simulation of horizontial shocking and drop tests with the explicit dynamian module of Ansys, explains the research methods and programs of applying Ansys in packaging dynamics, and acquires kinds of physical parameters of package such as acceleration, velocity and strain during the process of shocking and dropping.It analyzes and estimates the protecting abilities of packaging to inner products, concludes the response characterizations of every component of package to outer shocks, mainly discusses responses of fragile parts of electronic products to outer shocks as well.To getting a better result of studying packing properties and estimating simulations, this study latter employs improved drop tests and gets the acceleration and strain curves of some part of package during the dropping process.It integrates the physical tests data and simulation results to make a more complete and accurate research of packaging properties. Meanwhile, in comparison with test data and simulation results, it verifies the accountability of applying simulation methods in studying packing properties.