Mcm-d Bcb Media Technology Research

The MCM(Multi Chip Module) technique emerged for meeting the requirements of multifunction, small size, light weight, high reliability, high speed and high performance of the electronic products. MCM-D is a kind of MCM which is realized by the thin film technique, in which the medium technique is one of the key techniques. In this work, Benzocyclobutene (BCB ) with excellent quality was substituted for the conventional PI medium material in MCM-D process to meet the higher requirements of reliability and speed for the high-end electronic products. The work is focused on the key techniques of thickness control, curing process, etching and adhesion of generating BCB medium.The fitting numerical analysis to obtain different film thickness control condition was proposed based on the experimental results of BCB material characteristics. Accurate control of Film thickness was realized. The film thickness satisfied the requirements for the follow-up etching and electro plating and MCM-D circuit designs.For the medium curing, a new method of deriving the curing time and temperature from the medium reaction constant and the half-decay time was proposed in this paper. Making use of this method, a new fast curing process has been realized by using the high-temperature vacuum curing technique. The experimental result showed that the curing quality can meet the requirement for the follow-up process, and the problem of needing long time for the high-temperature vacuum curing process has been resolved.The plasma dry etching method was used to obtain the BCB film pattern. The effects of the process gas selection and every factor on the etching rate and the selectivity have been analyzed theoretically. A good condition of dry etching process has been obtained by setting up the orthogonal experiment method.For the adhesion of the film, a method of substituting the plasma cleaning for the coating adhesive solution was proposed. The adhesion of BCB film was measured by the method of the wire bonding pulling force and peeling off. The experimental results satisfied the requirements of the high-end products for the stability of the MCM process. The BCB medium has be en realized in the MCM-D process flow and satisfied the requirements for the experimental product through applying the single process researching results to the MCM-D products, thus, the BCB medium process is suitable for the practical application of MCM-D technology .