| In recent years, miniaturization and integration are the trends of the electronic product, especially in the wireless communication industry. Numbers of passive components occupied big area in all circuit design are integrated and modular. Nowadays low-temperature co-fired ceramic (LTCC) technology is becoming a pivotal means for integrating passives. However, LTCC materials have a high cost, as a result of it's brittle, it is not suitable to produce large-scale substrate, and limited to small modules or packages, the organic substrate manufacture technology had developed for a long time, the technology has been mature, and low cost, is suitable to produce large-scale substrate, at present, it has been widely used in a variety of printed circuit boards,semiconductor packaging substrates, but also is able to produce the high-density interconnect lines, in the development and applications of RF module is a great potential design platform on the substrate. The focus of this paper is that, based on the printed circuit board technology, integrate the passive components in the Multilayer organic substrate to achieve the function of the band-pass filter.The dissertation is classified into three Parts as follows: firstly, the structures of capacitors in the organic substrate were introduced, and introduced the role of capacitance in circuit boards at different locations, also compared the advantages and disadvantages of the various structures; as regards the precision of laser trimming, using Numeric Method to qualitative analysis of the relation of resistance and laser cutting. As for filters, using of the analytical method and network analysis to two band-pass filters both with three transmission zero, and achieved it in multilayer FR4 substrate. As for directional coupler. The return losses and isolation are improved by compensating capacitance. Good results were required, and the testing results of the experimental sample was agreement with the simulate results. |
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