Ka-band High-power Amplifier Design

A 43dBm solid state power amplifier module is designed in this dissertation. Two architectures of high power-combining efficiency are adopted to design the divider/combiner.The first architecture is based on a conventional corporate combining design using a low-loss waveguide septum binary adder. The second one is based on waveguide-based spatial power combining technology. Four-way (2×2) power combining approach by vertical stacking inside the waveguide is adopted. A perfect fin line transition is used to transfer the energy from waveguide to microstrip. The HFSS simulations indicate high port-to-port isolations and low insertion losses can be achieved by using both the structures.The E-plane probe and the gold wires bond are simulated with the high frequency software HFSS. Then we get the optimal structure for the circuit.The bonding, handling, mounting procedures for millimeter wave MMICs and the heat elimination are investigated and researched, which will be the guide to millimeter wave circuit achievement.