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Plastic Chip Hot Bonding Equipment, Pressure Systems

Posted on:2005-03-18Degree:MasterType:Thesis
Country:ChinaCandidate:J WangFull Text:PDF
GTID:2208360122997306Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
With the development of technology, microfludic chip that represents the development direction of micro total chemical analysis system have come to the front of biochips. It has several advantages such as high efficiency, fast separation and consuming a little amount of sample and reagent and been to the focus of life sciences, micromachine and microelectronics. However, the traditional microfludic chip is fabricated by silicon or glass. It has complex process, expensive price, can't fit to spread. Presently, hot embossing as a method, which are suitable for commerce for the fabrication PMMA chip offer, a variety of advantages: easy of manufacturing, low cost for high-volume fabrication. So, the aim of studying hot embossing and bonding machine is to provide valid equipment for scale-up chip markets.This paper is based on polymer hot embossing technology to study the pressure construction and control of the hot embossing equipment. Firstly, the hot embossing equipment abroad was summarized and the correlative pressure equipment was compared. Then the paper talks over the construction and pressure frame of equipment. The key point of construction is to ensure the pressure uniformity that chip endured. So the closed frame was adopted. And the key point of pressure control is to ensure the precision of pressure. The schematic circuit diagram was introduced, the model of pressure system was set up and the simulation of pressure system was executed. Base on the previous works, the PID controller was adopted. After the equipment was finished, the relation testes were done.Through the test, the conclusions were received, the precision of pressure control was less than 2kg. Further more, the hot embossing and bonding equipment can successfully execute automation, the optimized techniques parameters can duplicate identified. The fabricated chip's qualities excellence can be used to clinical analysis. So the hot embossing equipment can be used to polymer chip mass production.
Keywords/Search Tags:Polymer microfludic chip, Hot embossing and bonding, Mechanism design, Pressure control
PDF Full Text Request
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