Polymer Micro-flow Within The Control Chip Die Bonding Microchannel Deformation

The microfluidic chips were widly application in the field of life science, iatrology, new drugs exploitation,chemistry, foodstuff and enviroment inspecting etc.polymer microfluidic has been one hotspot of research because of its lower cost, simple produce procedure and easy for volume-producing. The conditional microfluidic chips manufacturing method were insufficient satisfied with the microfluidic manufacturing in large quantities for molding technology and bonding technology were compltely seperated. In this paper, the polymer microfluidic chips bonding in mold were introduced to solve the problems, and the research result will built the good foundation for microfluidic chips mass production.Firstly,the microfludic chips bonding force, surface tension of chips and bonding energy were introduced on the basic theoretics of polymer agglutination,and the microfluidic chips bonding process were analyzed in detail, the method of microfluidic bonding in mold were promoted , and the feasibility analysis of bonding in mold were studied .The cause and testing method of microfluidic chip bonding stress , bonding face micrcosmic disfigurement, microchannel ditortion and bonding intensity were presented. The study indicated that the flatness of substrate and cover plate influenced the bonding stress and bonding face micrcosmic disfigurement greatly, the lustration of chips affected the bonding face micrcosmic disfigurement,and bonding parameter played important roles in bonding intensity and the microchannel distortion.Secondly, microchannel distortion with the size of 0.1mm width and 0.04mm height in 1mm height substrate were studied by finite element softwre, results shows that the microchannel in substrate can not holding the cross-section shape and dimensional accuracy , the area of cross-section was decreased, the distortion of microchannel in height direction is more than width direction, and the dimensions of chip in width remain the same.The microchannel distortion increased with the compressed thickness and temperature increasement, the comprssed thickness affects the distortion more than temparature ,Microchannel distortion decreased with cover plate thickness increased ,but the decreasement is very small.Thirdly, A bonding mold was designed and the experiment of microfludic with 1mm cover plate was bonded in mold, then the bonding face micrcosmic disfigurement and microchannel distortion was detected.The study indicated that, there was a closed microchannel inside the microfludic, so the bonding method which comprssed mocroflucdic in mold was right.The micrchannel distortion mainly in height direction and the width direction was small,The distortion was increased with the increasement of compress thickness,temperature and time,and compress thickness affect the ditortion more than tempetature and time which was consistent to the simulation results,The experiment also indicated that increase the bonding parameters can improve the quality of bonding face micrcosmic disfigurement, the compress thickness and temperature affect the quality greatly ,and the bonding time affects the quality small.