Halogen-free Surface Mount Technology Solder Welding Reliability Impact

With the promotion of Greenpeace and World Electronics Association, electronics manufacturers introduced various electronic products, the halogen free standard:Cl<900ppm, Br<900ppm, Total <1500ppm.To the surface mount industry, with widely-used non-halogenated materials, the need for the research and verification of the halogen-free materials to see if can meet the process conditions; and verify the reliability of the product to ensure product quality.The two important factors the surface mount production line: printed circuit board and solder paste. In solder paste, the active agent use aliphatic dicarboxylic acid, aromatic amino acids and organic halogen compounds instead of organohydrohalides. Halogen-free solder paste used in phosphorus flame retardant epoxy resin (DOPO) to do bulk resin, phenolic resin as curing agent, plus inorganic filler to replace the original composition of brominated epoxy (TBPA, PBB, PBDEs as flame-retardant materials)To test five printed circuit boards to compare the property of Td, T260, Z-CTE, a1, a2, Tg. We select two vendors to meet the production needs. Then use the latest chipset platform, halogen, halogen-free solder paste, mount on the two PCBs. According to their welding conditions (dye-pry test, cross-section test, solder joint strength) and product reliability (drop, shock, and thermal cycle), halogen-free solder paste and PCB can meet the requirements of the process from the experiment results.