The Design Of Solder Paste Inspection System Based On Fpga

In the field of Auto Optics Inspecting, Mostly through the purchase of optical components and the use of PC-Base technology, development of software to achieve a variety of inspection function. With the elevation of the modern cameras precision, it will lead to mass data proliferation. The software process sequence structure has obstructed the process speed in PC and the data process pressure is also increasing very fast. Especially for the multi-camera system, which process image in every camera at the same time, the bottleneck of data process speed and process efficiency is more obvious.According to solve the bottleneck of the speed and efficiency problems in AOI, this task design a brand new structure about AOI—dividing the inspect target into two-level to inspect:Use the FPGA hardware circuit in camera to process mass image data to finish the primary inspection and use the PC to check the special targets which have not inspected in first level to finish the secondary inspection. The structure of two-level inspection transfers part of the image process to hardware, so the primary and mass image processes will be done by hardware. The research of this task has solved the mass transmission and low speed of inspection problems which have been existed in the traditional AOI.This paper introduces the method of using main-control chip FPGA in camera and embedded DSP to inspect the quality of solder paste elaborately by SPI(solder paste inspection) instance. And it has discussed the every stage about the auto inspection process of camera. Experimental results show that the performance of the design system has achieved the application requirements.