Mems And Mcm Flexible Hinge Design And Manufacture

Penetration weapon plays a very important role in the modern war for it can pierce blindages and destroy enemy's command centers in the very deep subterranean area. The precision of fuze system affects the attack effect of the penetration weapon. Meanwhile, the high-g micro-acceleration sensor system has a direct impact on the precision of fuze system. High-g micro-acceleration sensor system can be equipped on the huge size Earth Penetrating Weapon. The research of high-g micro-acceleration sensor system is very important to strengthen our national defense.This paper based on the military pre-research project of high g micro-array acceleration sensor system, which comes from the 11th five years plan. Aaccording to problems found in the experiment and new technology guideline, we start to research the flexure connection technology from 3 different aspects.Firstly, based on the mechanical analysis to four types of flexure hinges using micro size effect, their simplified calculation formulas of rotational stiffness around z-axis are deducted separately. The influence of design parameter on rotational stiffness, the micro manufacturing processes and their applicable occasions are obtained by analysis. The design parameters of flexure hinges were optimal designed by common and fuzzy optimum methods separately. It offers some academic basis to design and using flexure hinges in MEMS by comparing the advantages and disadvantages of two methods.Secondly, according to the design and analysis of flexure hinges in MEMS, the problems found in the experiment process and the technology standard to achieve, the MCM theory in electronic products and the micro-manufacturing method in MEMS, the concept of flexure multi-chips connection in high-g micro-acceleration sensor system was issued. The manufacturing method process includes metal film manufacturing method, bending technology and selection of driving was designed.Finally, theoretical analysis and finite element simulation to micro cantilever beam and flexure connection of multi-chips were done, the micro cantilever beam and flexure connection of multi-chips can bear a concussion to 2.0×10~5g was proved by the simulation and the result of test, which means the sensor system reached the requirement of 2.0×10~5g. The problem of non-jointing flexure connection in high g micro-array acceleration sensor system was solved, a new type of viable scheme for the multi-chips connection, high density packaging were supplied as well.