| High performance of the electronic packaging is needed for the development of IC at a very high speed, one of which is high density substrates. Glass-ceramic material is adopted by the LTCC (low temperature co-fired ceramic) multilayer substrates, which have the following advantages: low dielectric constant, low sintering temperature, good compatibility with Si in temperature coefficient of expansion. LTCC multilayer substrates can be used not only in packaging products, such as DIP, LCCC, PGA, QFP, BGA, CSP, MCM, SiP, but also in motherboard of computer, high-speed circuit board, power circuit board, electronic circuit board of the automobile, etc. Low sintering temperature and low dielectric constant glass material (designed as LDK) is the objective of this paper, which used as the main compostion of LTCC glass-ceramic substrates and fabricated by high-temperature melting. In this paper, the effect of alkali metal ions Li+, Na+, K+ and alkaline-earth metal ions Ca2+, Mg2+, Zn2+ on the performance of glass is investigated in detail, simultaneous, the effect of the ratio of glass to ceramic on the performance of glass-ceramic substrates is investigated, too. The investigation of the dielectric and thermal properties of the LDK glass is emphasized, due to its decisive function on the performance of the substrates. Based on the designed compositions, glass of six series, nineteen samples are prepared. The experimental result with application potential has been obtained by a gradually optimized process. LDK02m is founded with the best properties: an εr of 6.1, a temperature coefficient of expansion of 60.64×10-7/℃, a hemisphere temperature of 903℃,a soften temperature of 690℃,a resistance of 6.63×1012Ωcm. The glass-ceramic substrate comprised 50wt% LDK02m and 50wt% SiO2 can be sintered at 900℃, which possesses the properties: an εr of 5.1, a temperature coefficient of expansion of 35.32×10-7/℃, a resistance of 5.18×1013Ωcm. The results have proved that the adoption of metal ions not only reduces the... |
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