Structure Of Temperature Field And Thermal Stress Field Analysis

In engineering, structures may expand or contract while they are heated or cooled. At that time, if the structures are restrained the thermal stresses will happen. Sometimes, they are hurtful in engineering. However their influence on structural strength and stiffness must be considered in advance.The dissertation provides a numerical solution method of stable and transient temperature fields as well as thermal stress field in different types of structures under initial temperature values at the boundaries or thermal resources in the structure by use of the finite element method. On the basis of thermal conduction equations the FE formulation of the stable and transient temperature fields are provided at first. As an example, the FE formulation of transient temperature fields for plane problems has been shown in detail, in which the space of structures is discrete by use of the finite element method while the time is discrete by use of the finite difference method. The paper has also given some formulas to solve the thermal stress fields in different types of structures, for example, plane problems, plates and shells and 3-D problems which are under so-called temperature loads.Some examples involving such as plane problems, plates as well as shells and 3-D problems have been shown. It has been proved that the formulas and the corresponding programs shown in the paper are effective and reliable.Thus the procedures and the corresponding program could be recommended to be useful in practical engineering.