The Cpa-type Magnetron Sputtering Device Target Improvements And Magnetic Field Simulation Analysis Study

Magnetron sputtering deposition is the one key way of all method. It is widely used in microelectronics, optical coatings and surface treatment areas. It has more obvious advantage in large area coating particularly. The sputtering deposition rate and target utilization are more concerned during the production process. It has a decisive influence on arrangement of the designed magnetic and the target. So the target and the magnetic field must be optimized for this reason.The development process of sputtering is introduced in the second chapter. A way of resolving problems which we face has been fended. It provides a theoretical basis for the analysis and solving current problems.The theory of glow discharge voltage characteristics and the volt-ampere character curve are introduced in the third chapter which marked us deeply understanding of the discharge characteristics. For further in-depth understanding and knowledge theory of sputtering in electromagnetic field and the collision theory. The movement and distribution of charged particles are detailed in the movement. The relation is introduced between the energy and the sputtering yield in the sputtering yield. The empirical formula of sputtering yield for calculating the utilization ratio of target has been provided the theoretical support. With the growth of energy, the sputtering yield is increased at first and decreased later during the process. Factors of the deposition film are given, it provides a theoretical guidance for the production of high-quality and deposition rate. The requirement of the film is satisfied with hardness, thickness, structure and composition by adjusting the optimization of test parameters.The analysis and research about target and magnetic field of the magnetron sputtering is in the fourth chapter. The magnetic field not only affects the discharge characteristics, plasma distribution and cathode sputtering target of the etching rate, but also seriously restricted the target life, target utilization and at the same time affect the stability of the experiment and repeatability during sputtering. The theories of target surface magnetic field distribution, structural design and design principles have been researched, which provided the theoretical support for the rational design, arrangement of the magnetic field and increase the target utilization. The different dimensions of the cylindrical magnetic field are compared and simulation analysis by software Comsol 3.2a. Now we can draw a conclusion: the magnetic field can be better analyzed by using software Comsol 3.2a.This calculation theory of sputtering of the target surface etching provides a theoretical basis. In the target study, using the formula of given target, and from the volume method of rectangular then circular planar target plane target utilization rate is calculated, these methods points out the ways to improve their efficiency and the utilization of high rectangular planar target in the circular planar target conclusion.Chapter five describes the structure of CPA sputtering units based on a target, the magnetic field results of the study, analysis of existing targets, the existence of the advantages and disadvantages of the magnetic field, to find the reasons for the low utilization rate target. Through the target and the magnetic field improved, the utilization of the target is increased and achieved good economic results.