Diamond/Cu High Thermal Conductive Co-mposite Materials Fabricated By Composite Electrodeposition-Study On The Content And Distribution State Of Reinforced Phase Diamond Particles

With the development of science and technology, such as modern electronic industry, aerospace, and national defense industry, the design and production of electronic components, instruments and equipment become smaller, more lightweight, compact and efficient, and the power density of electronic device components is also higher, which lead to more heat generated during the process, and seriously affect the stability and reliability of electronic devices and components. Since traditional thermal management materials can’t meet the requirement of high heat dissipation performance, the development of highly integrated microelectronic instruments and equipment has been severely restricted. There is an urgent need to develop a new material with high thermal conductivity. In recent years, it is reported that a kind of metal matrix composites with reinforced particles has been prepared by many scholars. The methods of preparing a composite material are based mainly on powder metallurgy, such as infiltration method and sintering method under high temperature high pressure, which have made some progress. However, these methods have some shortcomings, such as complex control process, expensive equipment and large energy consumption. This research applies the normal composite electrodeposition technique which includes two methods that buring and intermittent stirring to study preparation of diamond/Cu composite material with high thermal conductivity. Systematical research and analysis of the two ways has aslo been done to quantify the relationship between process conditions and material property and particle distribution of composite materials. XRD and SEM has been used to analysis microstructure and particle distribution of composite materials, and the composite coating adhesion has been evaluated. At present, the preparation of diamond/Cu high thermal conductive materials by composite electrodeposition has not been reported. The research has studied the influence of a variety of factors and conditions in the burying sand and intermittent stirring sand on the content and distribution of diamond particles in preparing diamond/Cu composites in use of composite electrodeposition. It shows that the laws of how the kind of anode surfactant, the adding amount of surfactant, the cathode current density, the particle diameter size and concentration of particles and other factors impact on the composite diamond particle content and distribution. Through the process optimization, the composite material content of diamond particles has reached its maximum to52.7Vol%. By SEM analysis, it is reported that the diamond particles are closely packed, more evenly distributed, but there are some contact gap defects, this needs to be further in-depth study; by XRD analysis, it is reported that the diamond particles and cationic surfactants doesn’t change the crystal structure of Cu.