| The mould is one of the key equipment in the production process of continuous casting.Mould steel-leakage is a serious catastrophic accident. At present, with the improvement ofcasting speed, the mould steel-leakage forecast system has higher requirements.This paper studies the form of continuous casting steel leakage and analyzes commonsteel-leakage prediction method, researches on the choice of bonding steel-leakage, using K-type thermocouple temperature sensor, combined with MAX6675temperature conditioningchip to directly measure the copper mould temperature. The design selects FPGA chip as themain control module. FPGA has powerful functions in multi-channel data acquisitionprocessing, can be used to complete synchronous acquisition and processing dozens oftemperature data, and in order to improve the real-time and the accuracy of datacollection, and also provides the basis for the subsequent deeper data analysis.This paper firstly introduces continuous casting process, several common forms ofleakage and leakage-prediction modes, proposes the method of direct measurement tothe study on bonding steel-leakage through analysis and study, offers program design.Analysis technological process and technological requirement of casting field, selectsappropriate thermocouple, combined with proper temperature conditioning chip todesign hardware circuit of thermocouple temperature synchronous collection system.Meanwhile, designs the software part based on the hardware circuit which is dividedinto three parts including data acquisition, data processing&transmission and connectseach module by using component instantiation and finally complete all functions.Finally, sets up temperature data synchronous system experimental platform, usesLabVIEW software to realize the function such as real-time temperature display of eachmeasuring point, real-time temperature curve, history curve and temperature abnormal alarm,etc. The experimental results show the feasibility of thermocouple temperature synchronousdata acquisition system design and lay a foundation for further study on the follow-up. |