Dynamic Temperature Acquisition System Development & Process Control Optimization For Capping Process Of Semiconductor Industrial Mass-production

Ceramic package is kind of special package mode of semiconductor packaging, and it can be directly applied in high-power working condition. In semiconductor mass production, the yield of this kind of chip is low due to its complicated manufacturing process. And also, this impact to RF performance & reliability of products. In order to improve its production yield, here to take this subject as study direction. According to actual production conditions, 2 steps were proceeded during this study:Firstly, set up dynamic temperature acquisition system for parameter monitoring & management of capping process. By using MSComm communication widget on KOYO PLC CCM2 comunicaton protocol setup for communication achievement between PLC and host PC. And under this communication, all real-time production temperature of equipment can be acquired by system, and as base for in-depth analysis. This system enhanced the reliability of equipment operation, made temperature data to be traceable, and achieved visualization control of production temperature. Relative disadvantages of original equipment have been improved greatly. All acquired production temperature data is the base for next-step process optimization.Secondly, achieved process optimization on raw material & temperature paramerters setting basing on data source that provided by dynamic temperature acquisition system, by following 6 sigma DMAIC (Define, Measure, Analyze, Improve, Control) logic and using analysis tools of MSA (Measurement System Analysis), SOV (Source of Variation), DOE (Design of Experiment). During this optimization, statistic method, management method & semiconductor mass-production conditions were integrated together for analysis. And with this optimization, the production yield of capping process is greatly improved.