Coupled Electro-Thermal-Mechanical Analysis And Transient Characteristic Of Micro Gas Pressure Sensor Based On Micro-hotplate Technology

As the rapid development of microelectronic and micromachining technology, micromation has become an important development direction of the sensors. As micro-hotplate (MHP) based micro gas pressure sensor fabricated using the technology compatible with standard IC process has less volume, lower power, wider range, and more fast thermal response, etc, so it has become an important research direction in MEMS field at home and abroad. This paper mainly researched the MHP based micro pressure sensor from theory analysis, structure optimization, and performance test. The main contents as follows:First, the heat transfer of MHP in the form of micro pressure sensors has been introduced, and various forms of heat transfer are analyzed. With the theoretical-based, coupled electro-thermal-mechanical analysis has been simple introduced. The key problems in the MHP based micro gas pressure sensor design are described and analyzed the different width supporting bridge. Finally the heat conduction theory of MHP based on micro-pressure sensor has been introduced.Later, the MHP of micro pressure sensor coupled electrical-thermal-mechanical analysis has been described in a simulation point from. First, MHP of the electric theoretical analysis and of a theoretical analysis model are established; then, by the Ansys-finite element analysis software-the three different structure models of MHP are analyzed, and required its temperature corresponding relationship; and finally joined the thermal conductivity of the micro-pressure sensors are established, the model is analyzed by Ansys. The result of a conclusion is required by comparison.The model is analyzed by transient analysis and compared with the steady-state. The results are shown that, the steady-state analysis is simple and relatively short simulation time compared with transient analysis. The transient is not only able to record the final total in grid temperature and deformation trend, but also able to give each node in the process of change in temperature or deformation diagram. This process can be found problems but steady-state analysis hardly to. At the same time, the development of modern computers, the time of simulation analysis for the complex will be shorter and shorter and the transient analysis will be getting smaller and smaller. The biggest advantage of the transient analysis is the real-time. The relatively important part of the node, can be its real-time observation and research, so that the result can not only get the final result, but also be able to compare the variables generated its processes and can find the problems, it can make better design guidance.Finally, aim at the requirement of the sensor dynamic performance test, perfect pressure automatic control algorithm of the measurement and control system. The effects of the factors that affect the sensors are analyzed, then tests and analysis the temperature of MHP.