Audio Defect Analysis And Test Method Improvement Based On Audio Process Principle Of Handset

Alone with hand phone application turn to more popular, the functions of hand phone are much stronger than before. As a communication tool, to make a call is the basic function of a hand phone. In order to setup a call, hand phone must make sure its audio path can work normally.During manufacture course, many reasons may lead to defective phone fail on factory test, phone defect will not only depress product quality but also increase manufacture cost. So the best method to reduce manufacture cost and improve product quality is to find out root cause and take an active action to avoid defect again. Audio issue is an important kind among defective phones, and it has contributed main defect dpmu. This paper emphasize on research audio defect analysis and test method improvement. According to different failure mode, audio defects can be separated to 2 kinds: no sound (keypad no sound, no audioloop, no headset and no alert sound) and sound with noise (keypad sound with noise, audioloop noise, headset noise and alert sound with noise). Base on audio signal transmission principle, this paper research composing principle, function and test method of whole audio process circuit, and find out typical root cause of no sound and noise issue. According to different root cause, audio defects can be separated to 5 kinds: component issue, audio circuit design issue, audio circuit process issue, software design issue and audio process IC issue. Base on analysis and sum up, this paper provide doable solution to each kind of audio issue, and get distinct reduction of related defect consequently.For no sound issue, factory test can effectively capture them at present. This paper bring forward a new test method base on current status of production line, improve test efficiency and enhance test standard as more as possible, which make phone with audio defect can be captured during factory test and CQA defect rate can be depressed. At the same time, we work with related supplier of audio process IC to solve audio component defect issue, improve test ability of supplier, so that we can basically put an end to such issue which caused by component defect.