Research On RF MEMS Switch Packaging

RF MEMS switch is one of the most promising devices in the RF MEMS devices, but the problems in reliability and packaging block the development of the RF MEMS switches.In this paper, firstly, an electrical model of the RF MEMS switches is introduced, based on this model, we analyzes the packaging influences on the microwave characteristics of the RF MEMS switch. Through the research of the traditional RF MEMS switch packaging, two novel wafer level packaging projects for the RF MEMS switch were proposed, at the same time designs a equipment for the quartz wafer deep hole drilling was designed. The equipment can be used to drill the deep tiny hole in the quartz substrate as via hole for RF signal line.The first packaging project for the RF MEMS switches uses the high impedance silicon wafer as the packaging shell. The project applies the Au-Sn solder as the bonging materials and interconnection line. The second packaging project adopts the quartz as the substrate, via hole drilled by sandblasting is used for the RF signal extraction. These two wafer level packaging projects will have a big influence on the RF MEMS switches packaging, such as reducing the cost and raising the reliability of the RF MEMS switches.