Numerical Simulation Of Temperature Fields And Stress Fields For The Oxygen Sensor

With the more and more serious emission regulations, the development of the exhaust oxygen sensors has become increasing hot. Finite element analysis has been used successfully in this field. In this paper, the temperature field and the stress field of the oxygen sensor has been simulated based on ANSYS platform. Some effective principles are provided for the design of oxygen sensor.The axisymmetrical model is established for meeting the specific conditions of the thimble-type sensor, and the corresponding displacement constraint and pressure load are got according to the matching requirements. The heating rate of the heater has been tested by experiment, and then the temperature load has been set up. The integrated computer model for thermal analysis of the thimble-type sensor has been set up, which reduces the computational efforts while keeping the accuracy.The finite element analysis of temperature fields and stress fields of the thimble-type oxygen sensor is accomplished, and this paper analyzes how temperature fields and stress fields distribute in the different time. Analysis of stress fields of the thimble-type oxygen sensor in different environments has been done, and maximum stress is almost the same. The relationship of the structure feature dimension and the stress is founded, which can assist people to design a better sensor structure.The temperature fields and stress fields of the planar-type oxygen sensor is simulated. The result of the temperature fields shows that the temperature becomes uniform on the top of the planar-type sensor in 10 seconds while it also shows good temperature homogeneity in the thickness direction. The maximum stress appears near the junction of the freedom part and the limited part. Some instructive advices on the preparation and assemble of plate oxygen sensor are also referred.