Research On Characteristic Parameter Of Metallic Interconnection Electromigration Noise

Electromigration has caught more attention as one of the major mechanisms for VLSI, as the characteristic measurement become to sub-micrometer even to nanometer and the current density increase.Base on a brief description to the damage mechanism, noise, traditional denotable parameters for electromigration and the conception of fractal, the fractal theory is taken into the electromigration analysis. Denotation of fractional dimension in metal interconnection electromigration is established and the quality relationship of fractal dimension for time series, electron path and grain boundary. The fractal dimension of time series move up in electromigration nonage and go down after the voids informed, but the power spectral density always grows, which is shown in the model which is validated by the experimentation.The multifractal dimension parameter of noise for electromigration is simply explored. The change of singularity value has the same trend with the resistance: abruptly increase when voids informed and the multfractal characteristic is found in noise time series. Definitely, fractal parameters will character the electromigration in VLSI interconnection better.