The Model And Simulation Of Low Pressure Chemical Vapor Deposition

Micro Electric-Mechanical System (MEMS)is very important in high tech field, it is one of the main industries in the future. MEMS process is on the bottom of the MEMS design, it decides the performance of the MEMS devices and the effect of the design. The using of the process simulation software can cut the design cost and shorten the design time. Now we already have a few simulation software in the MEMS process field, but these software still has problems when fitting for the product lines. Especially at home, this filed is blank. So it is very imminency to develop the simulation software fit for the process line.There are many steps in MEMS process, deposition which includes PVD and CVD is one of the very important steps. CVD includes APCVD,PECVD and LPCVD. LPCVD is extensively used for its good performance on step coverage. The reaction mechanism is still not understood, though there are a lot of models in LPCVD, So we should choice a model very close to the experiment and make it to the simulation software.Firstly the paper introduces the MEMS and the MEMS CAD. Secondly it introduces LPCVD models and the simulation arithmetic. A one-dimension model is validated by calculating the experimentation data. Then we get a two-dimension model. It decompounds the deposition to two departments: the source gas deposition and the interspace gas deposition. The step coverage is come down to the disassemble proportion"A"of the interspace gas. Lastly we optimize the arithmetic and get the simulation software using C++. The software can simulation the change of the step coverage with"A". We can get the simulation result after we get"A"by experiment. The simulation results are very close to the experiment results.