Research On Micro-self-assembly At Liquid-liquid Interface |
Posted on:2007-11-12 | Degree:Master | Type:Thesis |
Country:China | Candidate:M Liu | Full Text:PDF |
GTID:2178360185496395 | Subject:Physical Electronics |
Abstract/Summary: | PDF Full Text Request |
In this paper we mailny investigated two-dimensional and three-dimensional self-assembly at liquid-liquid interface. A new self-assembly method was brought up that took place at liquid-liquid interface with solder as the bonding material. This method could be applied to various-shaped micro-parts and substrates of different materials to construct complex microsystems.The main process was as followed: micro-parts with special wettabilities floated at the liquid-liquid interface and formed an ordered 2-D aggregate. Passing the substrate down across the aggregate and simultaneously the micro-parts adhered to the substrate. After heating the solder on the binding sites of substrate was molten and drived the micro-parts self-align on the substrate.We also put forward a workable method to construct three-dimensional microstructures using lubricant-water interface as a template and SU8 micro-parts as elements.In this paper we introduced the concept of self-assembly and its state-of-the-art development, and discussed the experiment results and indicated a future research direction of self-assembly. |
Keywords/Search Tags: | self-assembly, liquid-liquid interface, solder, micro-parts |
PDF Full Text Request |
Related items |