The Design Of Module System Based On CSP Technology

The CSP is a new package technology, it is researched and developed by the Japanese in the beginning of 20 century 90s. It can make the scale of package style near to be equal to the packaged chip. The CSP technology is one of the hotspots in the domain of microelectronic, the mainstream and development direction to the future package technology. It has very wide application foreground. This investigation task is a match item for some weapon model of the PLA. Because of the advanced capability and special demand of the system structure witch ordered by its using environment and character, we must care about not only the function realization and capability demand of the system itself, but also analyze and calculate in system designing, in order to confirm the most fitted parameter for the system.For the scurviness using environment, the user has a strongly request to the stability of this circuit. On the other hand, there is some strongly limited has been ordered to its figure scale by the using environment of this circuit. In choosing the material and craft, the package technology of key part is been chosen one kind of CSP craft which is used a multiplayer ceramic board to be the middle support layer, and it's the result of consulting the MN-PAC of Matsushita electronic company, the C-CSP of Panasonic electronic company and the NuCSP of ESP company. Its inner interlinkage is adopting SBB technology. The silicon chip is connected with the middle support layer by using the Au nail head and the electric epoxy, and used the under-filled to improve its dependability. It has very good electronic capability, heat capability and packaging dependability. For the small figure, it can be used not only in this system, but also in equipment, and even be used in ASIC, DRAM, DSP in mobile phone, DV and PDA, etc. In this...