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The Study On Glass Substrate Carrier Material With High Density Holes Array

Posted on:2007-12-07Degree:MasterType:Thesis
Country:ChinaCandidate:J RuanFull Text:PDF
GTID:2178360182980919Subject:Materials science
Abstract/Summary:PDF Full Text Request
Biochip technology has made great progress entering 21st century. The key of biochip manufacture and analysis is to prepare the carrier material. The preconditions of preparation and analysis of the biochip is how to manufacture the biochip. Furthermore, the key factor of manufacture the biochip is how to prepare to the carrier material.The study of the high-density nanometer porous lattice biochip carrier material has put forward in China under that background. The glass substrate carrier with holes array on basis of Li2O-Al2O3-SiO2 system photosensitive glass-ceramics have been prepared, on which there was a selective solution rate in HF acid aqua after crystallization. That is, Li2O-Al2O3-SiO2 system photosensitive glass with a given component was been fabricated firstly, and then it was exposed in ultraviolet radiation under a quartz mask. Next, it was crystallized in the exposure areas of the substrates and lithium metasilicate microcrystal were gained after heat treatment at appropriate temperature. Finally, the partial crystallization substrate was etched with a given concentration HF acid aqua and holes array was gained as the crystallization areas were dissolved.So it is possible to machining different forms of holes array on the glass substrates under optimizing process conditions. The study of glass substrate with holes array whose capability in different type biology and chemical samples is very important, furthermore, the carrier material of glass biochip can be provided via the preparation of the glass sunstrate. The preparation of the high-density nanometer porous lattice biochip carrier material will be got. So it has enormous scientific value to research on biology and the Human Genome project.In the investigation, the structure of glass substrate sample was charactered by XRD, SEM, FESEM etc. The analysis results of UV-Vis spectroscopic, DSC/TG and linear thermal dilatability were also utilized to discuss how the factors effect on the properties of glass substrates. It can be concluded from results that Li2O-Al2O3-SiO2 system photosensitive glass-ceramics with a appropriate ingredient can performance well in the processing, and there is a phenomena of crystallization of lithium metasilicate after appropriate heat treatment process in the area exposed under UV.Besides, there were some changes of the exposure effects when ultraviolet radiation was completed with different masks. The best condition for machining of photosensitive glass-ceramics substrate is etched with a concentration of 5 vol.% HF acid aqua and stirring in a ultrasonic blender.It is possible to gain different form of holes array on the glass substrates on the basis of appropriate component of glass and process parameters resulted from the investigation, which include glass substrate with 4> 1 .Omm perforated holes array arranged in a 12 X 12 matrix, 01.0mm imperforated holes array arranged in a 12 X 12 matrix and
Keywords/Search Tags:photosensitive glass-ceramics, holes array, ultraviolet radiation, carrier material
PDF Full Text Request
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