Numerical Research On Heat Iransfer Of MCM Integral Circuit And Infrared Ray Light

Electronic devices are evolving toward a highly integrated and high-power way. But various failure modes are caused in integrated circuit (IC) modules because of instant heat generation, complex heat stress distribution, and some other reasons. In the same way, the failure probabilities increase in an exponential relation with the system temperature in an electronic system. So it is the essential task for the engineers to analyze the heat transfer in electronic devices and systems.In this paper, a thermal-mechanical analysis of a multi-chip packaging module is presented, with emphasis on the package warpage, thermally induced stress and the solder joint reliability. Then a LED infrared ray light is designed under technology characters, and its heat performance analysis is also discussed. Finally the cooling ways are discussed in order to decrease temperature distribution on its main faces.The materials discussed in this paper are organized as follows:In chapter 1, the research developments of package technology are surveyed. And then, the research background of LED infrared ray light is introduced.In chapter 2, the finite element method (FEM) is discussed including heat stress FEM, static and transient heat transfer, heat stress calculation, numerical heat transfer FEM, coupling heat transfer and hydrokinetics.In chapter 3, some correlative FEM analysis modes are proposed with the help of the universal commercial FEM tool -ANSYS.In chapter 4, reliability of the MCM assembly is done. The warpage of package and the residual stress of two kinds of modes are studied. Then, the effect of the distance between dices and package dimensions on the maximum residual stress as well as the warpage of the package are performed, and the failure modes of solders are also presented.In chapter 5, after suitable geometric simplifying as well as physical modeling, the static heat transfer analysis of the infrared ray light is done. And the comparison between the numerical results and experimental results proves the accuracy of the FEM models. The optimization design of the structure is done. According to the optimization results, some improved structures are proposed. Moreover, the temperature and flow field distribution under forced ventilation are also discussed.