Design And Analysis Of Embedded Passive Components In LTCC-based 3DMIC

As information age is coming, we make higher demands of the microwave integrated circuits.The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization.If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits(3DMIC) is the only way.But 3DMIC need the packaging material which has the higher performance ( especially to microwave loss)and the production capacity which has the higher volume and lower cost .Because of the excellent performence of low temperature cofired ceramic(LTCC) in some aspects (its most outstanding advantage is that it can embed passive components) , 3DMICs are realized really.This paper introduces the production process,classification and technical progress of 3DMIC.We summarize the schedule drawing and technical characteristics of LTCC,then presenting its function of embedding passive components(such as resistor,capacitor and inductor,etc.) roundly.The ADS,electromagnetism simulation software of the Agilent company,is used to design a series of novel multilayer spiral inductors, and we give some simulation result to prove their rationality. We research the test pattern and test method of novel multilayer spiral inductors.