In this thesis, two methods of fabrication of microchips were studied in detail. First, single crystal (100) silicon materials were wet etched with KOH solution in the first part of this paper. Based on new wet etching conditions and a novel convex corner compensation design, a silicon mold with smooth etched surface and perfect convex corner was obtained. Then a PMVS(polymethylvinylsilanxoin) microchip was successfully made with molding technology.In the second part of the paper, a photomask glass-based microchip was wet etched with buffered HF. And the problems of side etching and mask erosion were researched.
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